Fully-buffered DIMM technology
Memory modules capable of keeping pace with dual-core processing capacity.
Fully-buffered DIMM memory (FBDIMM) is the solution for addressing the scaling needs of storage capacity and memory bandwidth to keep pace with processor and I/O improvements of modern dual-core processors. FBDIMM offers up to three times the memory throughput* and provides up to four times the memory capacity** of previous Intel® server platforms with DDR2 memory. Innovatively integrated functions for increased data reliability and security help to improve data access, data integrity and automatic error correction. For the customer this means increased business productivity, built in reliability and longevity:
Increased business productivity
- Provides over 3 times higher memory throughput* allowing for superior application responsiveness
- Enables increased capacity and speed to balance capabilities of dual core processors
- Allows for Intel® I/O Acceleration Technology to more quickly access and process data
- Performs reads and writes simultaneously; eliminating the previous read to write blocking latency
- Supports a faster front side bus
- Provides Cyclical Redundancy Checking (CRC) protection for commands and data
- Delivers additional memory channels that can be used to mirror data and prevent loss from any single memory or DIMM failure
- Allows for simplified board designs through reduced pin count and less complex routing requirements
- Leverages support from industry-standards
- Per channel segment Silent Data Corruption (SDC) FIT rate less than 0.10 (1,142,000 years) to support even the highest-RAS servers
Longevity
- FB-DIMM is a long-term strategic direction for servers
- Server OEM suppliers aligned on long-term buffered DRAM memory solution
- Industry leading DRAM & DIMM vendors committed to delivering FB-DIMM products
- Industry investment in the technology expected to be leveraged over multiple generations
- Complete set of standards and tools for system development defined
- Smooth transition from DDR2 to DDR3 is possible using the same connectors and topology
* Based on the Dual-Core Intel® Xeon® Processor (5000 sequence, ?Dempsey?) Blackford chipset with four memory channels each running at 667MHz results in a theoretical throughput of 21.3 GB/s as compared to an Intel® Xeon® Processor with 800MHz FSB with Intel® E7320 chipset (2 memory channels at 400 MHz) gives 6.4GB/s theoretical throughput.
** Based on the Dual-Core Intel® Xeon® Processor (5000 sequence, ?Dempsey?) /Blackford chipset which supports up to 16 DIMM slots using 4GB DIMMs as compared to a system with an Intel® Xeon® Processor with 800MHz FSB and Intel® E7320 hipset which supports up to 8 DIMM slots with 2GB DIMMs.
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